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Description
The STAMPS3 is a main control core module, using a Lexin ESP32-S3FN8 main control chip, 8MSPI flash memory, an Xtensa 32-bit LX7 dual-core processor and a main frequency up to 240MHz. It has a built-in 5V to 3.3V circuit, an RGB status indicator, a programmable button, and a 1.27MM/2.54MM spacing lead. It supports SMT, DIP row, and DIP row jump wires. The module is suitable for IoT application scenarios with embedded main control modules.
We also stock a version with pin headers pre-soldered.
Features
- ESP32-S3FN8(2.4GHz Wi-Fi)
- Minimal system board
- Multi-IO lead-out, support multiple application forms (SMT, DIP, flying wire)
- Integrated programmable RGB LEDs and buttons
- Support UIFlow graphical programming
Specifications
| Resources | Parameters |
| MCU | ESP32-S3FN8 |
| DCDC | Highly integrated MUN3CAD01-SC |
| Flash | 8MB |
| Input voltage | 5V |
| Interactive | Programmable physical buttons x 1, programmable RGB LED (WS2812B-2020) x 1 |
| Antenna type | 2.4G 3D antenna |
| Module resource interface | Touch sensor, SD/SDIO/MMC master controller, SPI, SDIO/SPI slave controller, EMAC, motor PWM, LED PWM, UART, I2C, I2S, GPIO, pulse counter |
| IO interface x23 |
G0/G1/G2/G3/G4/G5/G6/G7/G8/G9/G10/G11/G12/G13/G14/G15/G39 /G40/G41/G42/G43/G44/G46 |
| Connection method | SMT/DIP (pitch 2.54mm and 1.27mm)/Jump Wire |
| IO interface spacing | 2.54mm x 1.27mm |
| Operating temperature | 0°C to 40°C |
| Product Size | 26mm × 18mm × 4.6mm |
| Package Size | 136mm × 92mm × 13mm |
| Product Weight |
3.2g |
| Package Weight |
7.5g |
Resources
Package Contents
- 1x StampS3
- 1x HY2.0-4P terminal
- 1 x 2.54-9P header
- 1 x 2.54-6P header
- 1 x Hex Key
- 1 × User manual
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